Recovery of TSV Based 3D IC

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Sudeep Ghosh
Mandira Banik
Tridib Chakraborty


: In recent years Through-silicon-via (TSV) based 3D integrated circuit (3D IC) has emerged as an important research area. But due to some manufacturing defects there may have some defected TSVs. To solve this problem it is needed to replace faulty TSVs by redundant TSVs. Allocation of redundant TSVs to a group of functional TSVs is an attracting solution to recover TSVs faults. In this paper we have addressed an approach to allocate redundant TSVs to a group of functional TSVs and to replace defected functional TSVs by the redundant TSV


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